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Semiconductor Wafer Packaging for Air Freight
客户
Semiconductor Fab
地区
台湾
行业
电子
回报
Yield improvement saved $200K/month
产能提升
+8%
人力节省
-15%
The Problem
200mm wafers experiencing micro-cracks during air freight vibration despite standard packaging.
The Solution
Multi-density EPE foam with vibration-dampening engineered structure. Real-time shock indicator added.
The Result
Micro-crack rate reduced from 2.5% to 0.05%. Customer passed stringent semiconductor quality audit.